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Die Attach Paste - List of Manufacturers, Suppliers, Companies and Products

Die Attach Paste Product List

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High thermal conductivity adhesive / die attach paste ATROX series

High thermal conductivity adhesive / die attach paste ATROX series

Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.

This product is a bonding material suitable for improving the reliability of semiconductor packages, characterized by void-free, high thermal conductivity, and low bleed-out properties achieved through unpressurized bonding, supporting the miniaturization and high-density implementation of packages that require high heat dissipation from devices.

  • Dedicated IC

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McDermid Dia Attach Paste ATROX800HT2VX

McDermid Dia Attach Paste ATROX800HT2VX

Silver sintered die attach paste has excellent thermal conductivity, minimal resin bleed-out, and low levels of condensable organic materials!

The "ATROX 800HT2VX" is a hybrid silver sintering die attach paste designed for GaN and SiC semiconductor power devices, featuring an exceptionally high thermal conductivity. With minimal resin bleed-out and low levels of condensable organic materials, it ensures excellent package reliability with differentiated performance on thin dies. Additionally, this product is formulated for application using the time-pressure pump commonly equipped on most die bonders. 【Typical Characteristics (Partial)】 <Uncured> ■Type of Chemical: Thermosetting ■Color: Gray ■Storage Temperature: -40℃/°F ■Shelf Life: 6 months *You can download the English version of the catalog. *For more details, please feel free to contact us.

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  • glue

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